Thermal Conductivity Measuring Instrument Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated：Aug 20, 2025 Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

Thermal Conductivity Measuring Instrument Manufacturer, Suppliers and Company Rankings

Last Updated：Aug 20, 2025 Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

横浜電子 Kanagawa//Industrial Electrical Equipment
カトーテック Kyoto//Testing, Analysis and Measurement
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ＤＪＫ Kanagawa//Resin/Plastic
ベテル Ibaraki//Manufacturing and processing contract 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場

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Thermal Conductivity Measuring Instrument Product ranking

Last Updated：Aug 20, 2025 Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

Measuring device for thermal conductivity measurement using the Guarded Hot Plate method (GHP method) 横浜電子
Thermal Conductivity Measurement Device Comprehensive Catalog 横浜電子
KES-F7 Thermo Lab カトーテック
Technical Data: Principle and Equipment for Measuring Thermal Conductivity with a Thermowave Analyzer ベテル本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
4 Thermal conductivity measurement device

Thermal Conductivity Measuring Instrument Product List

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Thermal Conductivity Measurement Device Comprehensive Catalog

Assist in the development of new materials for thermal insulation and cooling! Achieve reduced measurement time and expanded measurement temperature range!

The thermal conductivity measurement device manufactured by Yokohama Electronics is a high-grade model that achieves a reduction in measurement time and an expansion of the measurement temperature range by providing two channels. We have completed a thermal conductivity measurement device that adopts the flat plate direct method, which is widely used as part of research and development and quality control in various industries. 【Featured Products】 ■ Thermal Conductivity Measurement Device 　□ Calibration Thermal Conductivity Measurement Device (Single Specimen / Two Specimens) 　□ Chamber for LN2 　□ Thermal Conductivity Control Panel ■ Standard Thermal Conductivity Measurement Device ■ Ultra-Low Temperature Thermal Conductivity Measurement Device ■ Control Panel for GHP For more details, please refer to the catalog or feel free to contact us.

Company：横浜電子
Price：Other

Temperature and humidity measuring instruments
Other measurement, recording and measuring instruments

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Measuring device for thermal conductivity measurement using the Guarded Hot Plate method (GHP method)

This is a thermal conductivity measurement device for the calibration of the Guarded Hot Plate Method (GHP method).

The thermal conductivity measurement device focuses on absolute measurements under steady-state conditions, and has undergone extensive consideration and improvement over the years. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device using the flat plate direct method, leveraging its rich experience and outstanding technology, which is widely used as part of research and development and quality control in various industries. The thermal conductivity measurement device using the Guarded Hot Plate method (GHP method) JIS A 1412-1-1999 employs both single specimen and double specimen methods, and utilizes a chamber for LN2. 【Features】 ○ Thermal conductivity measurement device using the Guarded Hot Plate method (GHP method) ○ JIS A 1412-1-1999 ○ Single specimen method ○ Double specimen method ○ Chamber for LN2 For more details, please contact us or download the catalog.

Company：横浜電子
Price：Other

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KES-F7 Thermo Lab

A testing machine that measures the "contact thermal sensation" of feeling "warm" or "cold" when the skin touches the fabric using the index "q max" (peak heat flow value).

You can use it to evaluate bedding materials with a cool and refreshing feel for summer, as well as inner materials with a warm touch for winter.

Company：カトーテック
Price：Other

Testing Equipment and Devices

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[Measurement Case Studies] Thermal Conductivity Measurement

Introduction of measurement examples such as Laser/Xenon Flash (LFA) and Steady-State Measurement Method (TIM).

This document is a collection of measurement case studies summarizing the commissioned measurements of "thermal conductivity measurement" conducted by Japan Thermal Consulting Co., Ltd. It provides detailed examples of various measurement methods such as "Laser/Xenon Flash (LFA)," "Hot Bridge (THB)," and "Heat Flow Meter (HFM)" using diagrams. Additionally, we have included a "Thermal Conductivity Measurement Equipment Selection Guideline" that summarizes measurement items, equipment, sample types, and more on one page. We encourage you to read it. 【Featured Cases (Excerpt)】 ■ Laser/Xenon Flash (LFA) ■ Hot Bridge (THB) ■ Heat Flow Meter (HFM) ■ Thin Film Samples (TFA) ■ Steady-State Measurement Method (TIM) *For more details, please refer to the PDF document or feel free to contact us.

Company：日本サーマル・コンサルティング
Price：Other

Other measurement, recording and measuring instruments
Contract measurement

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Disc Heat Flow Meter Method (ASTM E1530)

This is a method for measuring accurate thermal conductivity without performing absolute measurements of heat quantity, by simultaneously measuring a reference sample with known thermal conductivity.

This measurement method, also known as the steady-state comparison method, is referred to as the protective heat flow meter method in ASTM E1530. In this method, a reference sample with a known thermal conductivity is measured simultaneously, allowing for the accurate measurement of thermal conductivity without the need for absolute heat flow measurements. A heater and a reference calorimeter are in close contact to create a steady state with a temperature difference of approximately 30K between the top and bottom of the test specimen. The thermal conductivity is then determined from the temperature difference at both ends of the test specimen and the output of the reference calorimeter.

Company：ＤＪＫ
Price：Other

Contract measurement

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Basics of Thermal Conductivity Measurement

Understanding the mechanism of heat transfer and effectively dissipating heat is important! Here we introduce various methods for measuring thermal properties.

Due to factors such as "miniaturization = fanless design" and "widespread use of power devices = increased heat generation," thermal issues have become important. Thermal conductivity measurement can be broadly classified into two categories: "steady-state method" and "transient method." The steady-state method provides direct thermal conductivity values and requires relatively large samples. The transient method can measure thermal diffusivity and thermal effusivity, and it is possible to measure with relatively small samples. We provide further detailed explanations, so please take a look at the PDF download below. 【Characteristics of the "Steady-State Method" and "Transient Method"】 ■ Steady-State Method - Direct thermal conductivity can be obtained - Requires relatively large samples ■ Transient Method - Can measure thermal diffusivity and thermal effusivity - Can measure with relatively small samples - Requires specific heat capacity and density *For more details, please refer to the PDF document or feel free to contact us.

Company：ベテル本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
Price：Other

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Technical Data: Principle and Equipment for Measuring Thermal Conductivity with a Thermowave Analyzer

Explanation of the principles of spot periodic heating radiation thermometry and the measurement devices!

This document explains the "principle and device configuration of the thermo-wave analyzer." It also includes features such as "high freedom of sample shape" and "ability to measure relatively thin samples." This technical document is recommended for those who want to understand the device from the principle. Please feel free to download and take a look. 【Contents】 ■ Introduction ■ Principle of spot periodic heating radiation thermometry ■ Measurement device ■ Measurement of thermal diffusivity of certified standard materials ■ Summary ■ References *For more details, please refer to the PDF document or feel free to contact us.